Jawatan Kosong die attach wire bond development technician Muar Disember 2019 Micron

Information of Job Vacancy

Title of Job : Die Attach/wire Bond Development Technician
Company Name : Micron
Placement : Muar
Date : 4 Oktober 2019
Expired : No

Jawatan Kosong Die Attach Wire Bond Development Technician Muar 2019 Micron. Good Morning for the friends who are hunting job. Hopefully not despair give up to find a job that corresponding with qualifications your needed. Indeed sometimes find a job that convenient is laborious in this year. On this occasion, the admin will give info Jawatan Kosong Die Attach Wire Bond Development Technician Muar 2019 Micron. Here news more detail about Jawatan Kosong Die Attach Wire Bond Development Technician Muar 2019 Micron.

Jawatan Kosong Die Attach Wire Bond Development Technician Muar 2019 Micron

Here is conditions job description that you must meet to applying Jawatan Kosong Die Attach Wire Bond Development Technician Muar 2019 Micron which opened earlier of this month:

Req. ID: 138711

Recruiter: Sarina Binti Madarasa

RESPONSIBILITIES:

  • Responsible for assists engineer in process development of die attached/wire bond process.
  • Setup die attach/wire bond assembly machine and prepare materials for NPI builds (engineering sample/qual sample)
  • Assist engineer for characterizing new recipe for die attach/devoid/strip plasma/strip ID mark/wire bond
  • Monitor performance, quality and reliability of assembly processes.
  • Identify problems or unfavorable deviations and recommend corrective and improvement actions.
  • Assist engineer for new equipment benchmark, optimization, capability roadmaps and tooling equipment.
  • Support new package development, ramp ups and platform extensions.
  • Support process roadmap updates for newly developed package technology.
  • Able to work in shift pattern


REQUIREMENTS:

  • Diploma in Electrical & Eletronics Engineering, Material Engineering, Material Engineering or similar subject.
  • Candidate must possess minimum 3 years in semiconductor industry in the field of package development or assembly engineering.
  • Experienced in die attach/plasma/wire bond process in IC assembly industry.
  • Good knowledge of data analysis/machine hands on
  • Knowledgeable in IC Packaging Assembly Process Flow.
  • Independent with good communication and co-ordination skills.
  • Great team work within the team and cross functional team


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law. This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords: Muar || Johor (MY-01) || Malaysia (MY) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-LT1 || Tier 2 ||

Only job candidates that satisfies to qualifications above of that will be called upon to perform the next test. For that, if you are interested and meet the candidates Jawatan Kosong Die Attach Wire Bond Development Technician Muar 2019 Micron above, please submit your application before not applicable.

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