Jawatan Kosong engineer unit process engineering wire bond Melaka September 2020 Infineon Technologies

Information of Job Vacancy

Title of Job : Engineer - Unit Process Engineering Wire Bond
Company Name : Infineon Technologies
Placement : Melaka
Date : 30+ days ago
Expired : No

Jawatan Kosong Engineer Unit Process Engineering Wire Bond Melaka 2020 Infineon Technologies. Good Morning for my friends who are hunting job. Hopefully not despair stop to find a job that well suited with desire your needed. Indeed once in a while find a job that convenient is difficult in this year. On this occasion, the admin will give news Jawatan Kosong Engineer Unit Process Engineering Wire Bond Melaka 2020 Infineon Technologies. Here news more detail about Jawatan Kosong Engineer Unit Process Engineering Wire Bond Melaka 2020 Infineon Technologies.

Jawatan Kosong Engineer Unit Process Engineering Wire Bond Melaka 2020 Infineon Technologies

Here is criteria job description that you must meet to apply Jawatan Kosong Engineer Unit Process Engineering Wire Bond Melaka 2020 Infineon Technologies which opened end of this month:

At a glance

Owner for quality and yield improvement for wirebond process


Job description

In your new role you will:

  • Process owner for the wire-bond process (UPE)
  • Carry out tasks for T32 qualification, DDM, MRB. line sustaining and improvement, SPC monitoring, and improvement, material consumption improvement.
  • Wirebond improvement activities for NLOZD and NLOP
  • Problem solving for daily production issue such as quality and improvement topic.

Your Profile

You are best equipped for this task if you have:

  • Possess a Bachelor's degree in Mechanical, Mechatronic, Manufacturing or Electronic engineering.
  • 2-5 years experience in wirebond process engineering background. Experience in the ASM wire bond machine would be an advantage.
  • Able to perform and use systematic analysis tools such as 8D, SPC, 6-sigma tools in daily job.
  • Able to work as a team with others process.
  • Good in presentation skills, English proficient, and good in basic software tools like Microsoft Power Point and Microsoft Excel.
  • Willing to learn and adopt to new environments and practices.

Why Us

Part of your life. Part of tomorrow.
We make life easier, safer and greener – with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world – we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.
(Malaysia) Sdn Bhd, with its 8.000 employees, is the largest manufacturing site of Infineon. The company has established itself as a leading manufacturing site for Power Semiconductors, Logic Semiconductors, Discrete and Sensor Products. We are committed to increasing productivity, on-time delivery and providing customized solutions while maintaining the highest level of product quality. The success of Infineon Melaka is evidenced by eleven National Awards received from the Prime Minister’s Office as well as 15 corporate awards.


Only applicants that meet to qualifications above of that will be called upon to perform stage test. For that, if you are interested and meet the job candidates Jawatan Kosong Engineer Unit Process Engineering Wire Bond Melaka 2020 Infineon Technologies above, please submit your application before vacancies closed.

Thus information Jawatan Kosong Engineer Unit Process Engineering Wire Bond Melaka 2020 Infineon Technologies that we can inform. hopefully info job today help you all who are seeking employment. If the info above vacancy does not fit with your specialties, it never hurts to read information another job vacancies below. Finally, we say gratefulness already visited this website, do not forget to share info this beneficial through twitter. Hope you will find a job and work hard!

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